Layer Count
8 Layer Stackup
Signal Integrity
99.8% Efficiency
Project by
Munib Naveed
Power Supply Design
A high-speed digital interface board designed to synchronize clock signals across distributed sensory networks. This project focuses on minimizing EMI and optimizing impedance matching for ultra-low latency data transfer.
Impedance Control: Mastered differential pair routing and length matching for 10Gbps signal paths.
Power Integrity: Designed a robust PDN (Power Distribution Network) to eliminate transient noise.
Thermal Management: Implemented strategic thermal vias and heat-sink zones for high-wattage ICs.
Technical Mastery Achieved
Layer Count
8 Layer Stackup
Signal Integrity
99.8% Efficiency
Project by
Munib Naveed
Power Supply Design
A high-speed digital interface board designed to synchronize clock signals across distributed sensory networks. This project focuses on minimizing EMI and optimizing impedance matching for ultra-low latency data transfer.
Impedance Control: Mastered differential pair routing and length matching for 10Gbps signal paths.
Power Integrity: Designed a robust PDN (Power Distribution Network) to eliminate transient noise.
Thermal Management: Implemented strategic thermal vias and heat-sink zones for high-wattage ICs.
Technical Mastery Achieved
Layer Count
8 Layer Stackup
Signal Integrity
99.8% Efficiency
Project by
Munib Naveed
Power Supply Design
A high-speed digital interface board designed to synchronize clock signals across distributed sensory networks. This project focuses on minimizing EMI and optimizing impedance matching for ultra-low latency data transfer.
Impedance Control: Mastered differential pair routing and length matching for 10Gbps signal paths.
Power Integrity: Designed a robust PDN (Power Distribution Network) to eliminate transient noise.
Thermal Management: Implemented strategic thermal vias and heat-sink zones for high-wattage ICs.
Technical Mastery Achieved