Advanced Mixed-Signal Design Bootcamp
Move beyond basic PCB design and learn to engineer advanced embedded hardware, from architecture and high-speed design to mixed-signal, RF and power integrity.
Releases 12 Dec 2026Curriculum
Blueprint
A step-by-step technical breakdown from foundational concepts to hands-on, industry-ready application.
Course Overview
Designing a PCB is only the beginning. As products get more complex, you meet high-speed interfaces, sensitive analog signals, RF circuits, complex power architectures and strict signal and power integrity requirements.
This hands-on program is for PCB designers, electronics engineers, embedded engineers and hardware professionals who want to move beyond basic board design. You will bring everything together in one complete product development workflow.
You will design a full-fledged advanced embedded product that includes:
- •An advanced microcontroller
- •High-speed digital interfaces
- •Multiple sensors and peripherals
- •Analog and digital circuitry
- •RF/wireless connectivity
- •Power management and distribution
- •Memory and data-storage interfaces
- •Signal integrity and power integrity considerations
- •EMI/EMC-aware PCB design and manufacturability
The goal is not just to finish a PCB. It is to teach you how to reason through engineering decisions: why this MCU, why this power architecture, why this stack-up, where the return current flows, and which nets need impedance control or length matching.
This is NOT a beginner course. You should already understand basic electronics, schematics and PCB design.
Modules
Module 1: Advanced Hardware Architecture
Translate product requirements into a practical architecture: functional blocks, MCU/SoC selection, power, sensors, memory, RF, protection and component trade-offs.
Module 2: Advanced MCU-Based Hardware Design
Design around a high-performance MCU/SoC: power, clocking, reset and boot, decoupling, memory and high-speed peripherals, debug interfaces and power sequencing.
Module 3: High-Speed Digital Design
Transmission lines, controlled impedance, differential pairs, return paths, reference planes, stack-up planning and high-speed routing strategies.
Module 4: Power Integrity & Power Distribution
Power tree architecture, DC/DC converters and LDOs, sequencing, decoupling, PDN concepts, ground strategy, power planes and noise reduction.
Module 5: Mixed-Signal PCB Design
Integrate analog, digital and RF on one board: ADC/DAC considerations, grounding, power-domain separation, return-current management and analog/digital partitioning.
Module 6: RF & Wireless Hardware Design
Practical RF layout for connected products: RF signal paths, antenna considerations, keep-out regions, matching concepts and digital/RF interference.
Module 7: Sensor & Peripheral Integration
Integrate multiple sensors and peripherals over I²C, SPI, UART, GPIO, ADC, interrupts, high-speed digital and wireless interfaces.
Module 8: Advanced PCB Layout
Apply advanced layout to the real product: placement, critical paths, differential routing, length matching, via strategy, analog and RF layout, thermal, EMI and DFM.
Learning outcomes
- •Architect complex embedded hardware and design around advanced MCUs/SoCs
- •Design mixed-signal PCBs that integrate analog, digital and RF systems
- •Apply signal integrity and power integrity principles to real products
- •Route high-speed interfaces correctly with proper stack-up and impedance control
- •Identify hardware risks before manufacturing and make better component-selection decisions
- •Complete a full advanced embedded product design for your portfolio
Practical Simulation Walkthrough
Watch as we walk through Advanced Mixed-Signal Design Bootcamp in real-time, applying advanced techniques before you build.
- Architect complex embedded hardware and design around advanced MCUs/SoCs
- Design mixed-signal PCBs that integrate analog, digital and RF systems
- Apply signal integrity and power integrity principles to real products
- Route high-speed interfaces correctly with proper stack-up and impedance control
- Identify hardware risks before manufacturing and make better component-selection decisions
- Complete a full advanced embedded product design for your portfolio